In this video I explain the Cooling Technologies of the Future.
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date: 2024-07-30 15:00:36
duration: 00:19:10
author: UCORX3Cl7ByidjEgzSCgv9Yw
This Microchip Breakthrough will Keep Moore’s Law Alive: Stacking Chiplets and Transistors on Top of Each Other
As the demand for semiconductors is expected to increase by a factor of 100 over the next 5 years, chip makers and semiconductor fabs are pushing the boundaries of innovation. One significant breakthrough is vertical integration, where chiplets (small pieces of silicon) are stacked on top of each other to create more powerful and efficient chips. However, this comes with a significant challenge: heat dissipation.
Traditional cooling methods, such as air cooling, have limitations, and the industry is turning to more advanced techniques. For example, liquid cooling, which can conduct up to 3,000 times more heat than air, is becoming increasingly popular. Researchers have developed novel cooling technologies, such as transistor-level cooling, where microscopic channels are integrated into the chip to remove excess heat.
Another promising approach is direct on-chip water cooling, where tiny channels are etched into the silicon to facilitate heat removal. This technology has been demonstrated by TSMC, who have shown that it can dissipate up to 2.6 kilowatts of heat. This breakthrough has significant implications for the future of computing, as it allows for the creation of even more powerful and efficient chips.
As the industry continues to push the boundaries of what is possible with chip design, it’s clear that the future of computing will be shaped by innovative cooling solutions. With the potential to reduce heat dissipation by a factor of 50, these new technologies will keep Moore’s Law alive and enable the creation of even more powerful and efficient chips.
